CVI bumps single die, partial and
complete wafers to reflect true flip chip die.
UBM is added followed by solder
No gold stud bump and epoxy
To better simulate real world CVI offers
overmolded QFN and modular
Our expanded capability includes higher
density leads as well as new
integrated coiled packaging.
PCB repair kits.
Lead, pads, and pads
Various sizes and shapes.
Pads as small as 60um