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Through glass vias and filled vias up to 40:1 aspect ratio. Image shows 30um diameter, 50um pitch, and 480um tall
Assembly services for small form factor boards and modules. Substrate design and fabrication in both organic and glass.
Complete quick turn wafer bumping, RDL and ENIG pillars.
PCB and substrate layout. Die repair kits.
Single die and partial wafers.
Overmolded QFN, open cavity solutions, die extraction and LGA/BGA.
Wide variety of dummy die in bond pad and bumped footprints. Custom builds optional.