| Die Bumping | Single die and partial wafers |
| Wafer bumping | Complete wafer bumping, RDL and ENIG pillars. |
| Packaging | Overmolded QFN, open cavity solutions, die extraction and BGA. |
| Assembly | Assembly services for small form factor boards and modules |
| Wirebonding and PCB Layout and Repair Kits | PCB and substrate layout. Die repair kits
Wirebonding services (gold ball and ball? |
| Dummy Die | Wide variety of dummy die in pad and bump format. Custom builds optional |
| For additional information, solutions or to check contact CVI at info@covinc.com or call 469-368-7475 | |
