Packaging

pending coil New patent pending coil in package technology. Call for Details !

CVInc offers a a variety of custom and off the shelf overmolded and open cavity packages. Optional finishes include NiAu, NiPd and NiPdAu.

A new patent pending solution offers packages with integrated coils for various technologies and applications. Call for information.

Please call CVI for details on your application. Open cavity packaging is available as well.
TQCollier@covinc.com or info@covinc.com

QFN
QFN
2×2
3×3
4×4
5×5
6×6
9×9
Higher pin counts available. Call for details.
TQ-CFN
TQ-CFN (custom)
3×3
4×4
5×5
6×6

Contact for details and information

HD-QFN-(high-density
HD-QFN (high density
4×4 packages
52 pin
84 pin
104 pin

4×4 (custom)
5×5 (custom)

MOD-SOP-SON
MOD/SOP/SON (custom designs)
4×4
5×5
6×6
7×7
8×8
10×10

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