| Die Bumping | Single die and partial wafers |
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Complete wafer bumping, RDL and ENIG pillars. | |
| Packaging |
Overmolded QFN, open cavity solutions, die extraction and BGA. (more info) |
| Assembly |
Assembly services for small form factor boards and modules (more info) |
| PCB Layout and Repair Kits |
PCB and substrate layout. Die repair kits (more info) |
| Dummy Die |
Wide variety of dummy die in pad and bump format. Custom builds optional (more info) |