| Process | Description | In-house or Partner |
| Board layout | PCB, RDL and substrate design, layout
and
validation |
In house capability for standard and high
frequency |
| Fabrication | Inorganic and organic substrate fabrication. |
PCB outsourced. All wafers, QFN and
modules in house.
|
| Wafer thinning | Thinning down to 100um | Partner same day service |
| Singulation | Die and package singulation | Partner same day service |
| Pick and place |
Pick and place into waffle packs or vacuum
gel packs
|
In house staffing and resources. |
|
Die and component placement |
Placement equipment has less than 5um accuracy for bumped die. Can handle die as small as .25um |
In house equipment, engineers and design
resources.Wirebonders, die placement tools and reflow equipment. |
|
Gold stud bump/ENIG pillars |
Bump die and attach thermosonically or with ACP |
In house |