The objective of our business is to provide quick turn, high quality service, reliable products and engineering solutions for our customers.Read More
Contact sales/marketing at email@example.com for additional information, product solutions, and new developments…….or call 972-664-1568
Through glass vias and filled vias up to 40:1 aspect ratio. Image shows 30um diameter, 50um pitch, and 480um tall
Assembly services for small form factor boards and modules. Substrate design and fabrication in both organic and glass.
Complete quick turn wafer bumping, RDL and ENIG pillars.
PCB and substrate layout. Die repair kits.
Single die and partial wafers.
Overmolded QFN, open cavity solutions, die extraction and LGA/BGA.
Wide variety of dummy die in bond pad and bumped footprints. Custom builds optional.