PCB and Repair Kits
IIIVto75 and IIIV-75
Ask us about IIIV-75 and IIIVto75
Through Glass Vias (TGV) with up to 40:1 aspect ration (20um DIA)
New integrated coiled QFN packages. Overmolded with standard and 150um pitch in 4mm to 10mm footprint.