Dummy Die

CVI has a variety of available NRE wafers and die for development, qualification and die builds.

Die have footprints in silicon, alumina, Pyrex and glass (borosilicate and high lead).

Various sizes and connection technologies include:

  • aluminum and copper pads
  • gold ball bumps
  • solder bumps for CSP and WLCSP and
  • copper pillars
  • and ENIG/ENIPIG pillars

Call or email for current inventory.
TQCollier@covinc.com or info@covinc.com

990 N Bowser Rd
Suite 860
Richardson, Texas 75081

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