CVI has a variety of available NRE wafers and die for development, qualification and die builds.
Die have footprints in silicon, alumina, Pyrex and glass (borosilicate and high lead).
Various sizes and connection technologies include:
- aluminum and copper pads
- gold ball bumps
- solder bumps for CSP and WLCSP and
- copper pillars
- and ENIG/ENIPIG pillars
Call or email for current inventory.
TQCollier@covinc.com or email@example.com
990 N Bowser Rd
Richardson, Texas 75081