|PCB, RDL and substrate design, layout and validation
|Inorganic and organic substrate fabrication.
|Thinning down to 100um
|Die and package singulation
|Pick and place
|Pick and place into waffle packs or vacuum gel packs
|Die and component placement
|Placement equipment has less than 5um accuracy for bumped die. Can handle die as small as .25um
|Gold stud bump/ENIG pillars
|Bump die and attach thermosonically or with ACP
“CVInc is certified ITAR compliant.” CVInc will support small custom and prototype build with all work completed in the US.