|Board layout||PCB, RDL and substrate design, layout and validation|
|Fabrication||Inorganic and organic substrate fabrication.|
|Wafer thinning||Thinning down to 100um|
|Singulation||Die and package singulation|
|Pick and place||Pick and place into waffle packs or vacuum gel packs|
|Die and component placement||Placement equipment has less than 5um accuracy for bumped die. Can handle die as small as .25um|
|Gold stud bump/ENIG pillars||Bump die and attach thermosonically or with ACP|
“CVInc is certified ITAR compliant.” CVInc will support small custom and prototype build with all work completed in the US.