Process Description
Board layout PCB, RDL and substrate design, layout and validation
Fabrication Inorganic and organic substrate fabrication.
Wafer thinning Thinning down to 100um
Singulation Die and package singulation
Pick and place Pick and place into waffle packs or vacuum gel packs
Die and component placement Placement equipment has less than 5um accuracy for bumped die. Can handle die as small as .25um
Gold stud bump/ENIG pillars Bump die and attach thermosonically or with ACP

“CVInc is certified ITAR compliant.” CVInc will support small custom and prototype build with all work completed in the US.

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