CVI Technology

CVI bumps single die, partial and complete wafers to reflect true flip chip die.

UBM is added followed by solder and reflow.

No gold stud bump and epoxy mess!

Prototype packaging is essential in the prototype and development phases where long lead times can be project killers.

To better simulate real world CVI offers overmolded QFN and modular packages.

Our expanded capability includes higher density leads as well as new integrated coiled packaging.

PCB repair kits.

Lead, pads, and pads with traces.

Various sizes and shapes.

Pads as small as 60um

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