CVI provides quick turn bumping of wafers for development, qualification, sampling and prototype builds. Bumps are available in leaded and lead free alloys.
Expedited bump builds, including RDL and fanout, can be completed in 4-6 working days depending on number of metal and passivation layers.
| Wafer Materials | Si, GaAs, Pyrex, Alumina | Up to 8” |
|---|---|---|
| RDL | Cu (typical 6um thick) Al (typical 1.25um thick) | Aspect and gap (call for details) |
| Passivation layer | Available PBO and polyimide layers in both high temp and low temp alternative (<200C cure for Pi/PBO) | Customer specified |
| Bump | ENIG pillars, SnPb, SAC and indium solders | Bump size specified by customer |
| Thinning | Down to 100um | Customer defined |
| Singulation and pack | P1 marking available |