Die Bumping

CVI supports three forms of bumping SINGLE DIE and wafers.

1. Standard solder bumping where a UBM and solder bump are formed. This is the most similar to high volume, high reliability bumps on the market.
2. Modified solder bumps where a gold stud bump is placed on the pad and the die is then placed in solder to grow a bump.
3. Thermosonic or ultrasonic bumping. A gold stud bump is applied to the die. The die is then thermosonically attached to the substrate.

Solder bumps (as small as 25um and 35um pitch) and copper pillars ( 20um DIA and 25um pitch) are available options.

CVI can also grow pillars on single die using a NiPdAu or NiAu stack and using CVInc customer preforms. This process is a cost savings over 20um tall pure Au pillars used in RF, RFID and optical assemblies.