|Single die and partial wafers
|Complete wafer bumping, RDL and ENIG pillars.
|Overmolded QFN, open cavity solutions, die extraction and BGA.
|Assembly services for small form factor boards and modules
|PCB Layout and Repair Kits
|PCB and substrate layout. Die repair kits
|Wide variety of dummy die in pad and bump format. Custom builds optional
|For additional information, solutions or to check contact CVI at email@example.com or call 972-664-1568