| Process | Description |
|---|---|
| Board layout | PCB, RDL and substrate design, layout and validation |
| Fabrication | Inorganic and organic substrate fabrication. |
| Wafer thinning | Thinning down to 100um |
| Singulation | Die and package singulation |
| Pick and place | Pick and place into waffle packs or vacuum gel packs |
| Die and component placement | Placement equipment has less than 5um accuracy for bumped die. Can handle die as small as .25um |
| Gold stud bump/ENIG pillars | Bump die and attach thermosonically or with ACP |
“CVInc is certified ITAR compliant.” CVInc will support small custom and prototype build with all work completed in the US.